Introducing Next-Generation Instrument Physical AI Reference Technology Connectable with On-Chip Web 3.

Introducing Next-Generation Instrument Physical AI Reference Technology Connectable with On-Chip Web 3

[DataNet] Emotionwave Unveils 'Software-Centric Physical AI' Strategy for Musical Instrument Manufacturing — image 1

Emotionwave announced that it will reveal its new technological vision at NAMM Show 2026, the largest music and instrument expo in the US. At this exhibition, Emotionwave plans to showcase various technologies and solutions under the theme of 'Innovation in the North American Instrument Market through Physical AI-based On-Device AI and On-Chip (Web 3) Architecture.'

NAMM Show 2026 will be held from the 22nd to the 24th at the Anaheim Convention Center in California, USA. NAMM Show annually features over 110,000 visitors and more than 7,000 global companies showcasing the latest technologies and products.

Emotionwave emphasizes a Physical AI strategy for instrument manufacturers at this exhibition. The on-device AI structure is designed to operate in existing general-purpose SoC and MCU environments installed in instruments, without requiring dedicated AI chips or attached devices, allowing manufacturers to introduce AI functions without increasing the BOM.

Physical AI-based performance recognition technology analyzes the performer's timing, rhythm stability, and repeating patterns in real time directly within the instrument through AI model lightweighting and on-chip optimization, providing immediate feedback. Through this, instruments are expanded beyond simple playing tools into intelligent platforms capable of practice, learning, and feedback.

At NAMM Show 2026, the mew drum on-device AI module for drums/rhythm instruments and the RIMA Physical AI Reference Architecture, which helps manufacturers quickly apply performance recognition functions to their own SoC/MCU platform, will be introduced together. This reference does not mandate a specific chip but provides firmware integration guides and implementation know-how.

Furthermore, it will propose an architecture structure that allows for on-chip Web 3 module linkage, suggesting the scalability to safely process performance data within the instrument and connect with external platforms as needed.

Cheon Eun-hyung, a senior researcher at Emotionwave, said, “The key to introducing AI in the instrument industry is not changing the hardware but adding intelligence on top of existing SoCs and MCUs,” adding that “Emotionwave is presenting a realistic solution that can simultaneously expand the performance experience and product value while maintaining manufacturing costs.”

Original article: DataNet Reporter Kang Seok-oh